TSMC announced 2nm advanced process, mass production in 2025

Last week, TSMC held the 2022 North American Technology Forum and debuted N2, a 2nm advanced process technology using nanosheet transistors, and the unique TSMC FINFLEX™ technology supporting N3 and N3E processes.

In terms of technical specifications, N2 is 10~15% faster than N3 at the same power consumption; 25~30% lower power consumption at the same speed, opening a new era of high performance.

Key technology highlights of the Technology Forum include:

TSMC FINFLEX™ technology supporting N3 and N3E: TSMC's industry-leading N3 technology is expected to enter volume production in the second half of 2022 and will be paired with the innovative TSMC FINFLEX™ architecture, providing unparalleled flexibility for chip designers.

N2 technology: Compared to N3, it offers a 10-15% speedup at the same power consumption or a 25-30% power reduction at the same speed.

N2 uses Nanosheet transistors (Nanosheet) instead of FinFETs (Fin Field Effect Transistors). In addition to the basic version for action computing, there will be integrated solutions for high-performance computing and small chips. n2 is expected to start mass production in 2025.

TSMC also revealed that N7 chips are already in mass production and N5 technology is expected to be completed in 2023.

To meet customer demand for system integration chips and other TSMC 3DFabric™ system integration services, the world's first fully automated 3DFabric™ fab is expected to begin production in the second half of 2022.

TSMC Announcement:

https://pr.tsmc.com/chinese/news/2939